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CVE-2023-33077 | Qualcomm 8 Gen 1 Mobile Platform HLOS memory corruption
A vulnerability was found in Qualcomm 8 Gen 1 Mobile Platform, 670 Mobile Platform, 710 Mobile Platform, 835 Mobile PC Platform, 855 Mobile Platform, 855+, 860 Mobile Platform SM8150-AC, 865 5G Mobile Platform, 865+ 5G Mobile Platform SM8250-AB, 870 5G Mobile Platform SM8250-AC, AQT1000, AR8035, Auto 5G Modem-RF Gen 2, C-V2X 9150, FastConnect 6200, FastConnect 6800, FastConnect 6900, FastConnect 7800, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QAMSRV1H, QAMSRV1M, QCA6310, QCA6320, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6574AU, QCA6584AU, QCA6696, QCA6698AQ, QCA8081, QCA8337, QCC710, QCN6224, QCN6274, QCN9074, QCS410, QCS610, QCS8155, QFW7114, QFW7124, Qualcomm Video Collaboration VC1 Platform, Qualcomm Video Collaboration VC3 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SA8650P, SA8770P, SA8775P, SA9000P, SD670, SD835, SD855, SD865 5G, SDX55, SRV1H, SRV1M, SW5100, SW5100P, SXR1120, SXR2130, W5+ Gen 1 Wearable Platform, WCD9326, WCD9335, WCD9340, WCD9341, WCD9370, WCD9380, WCN3610, WCN3660B, WCN3680B, WCN3950, WCN3980, WCN3988, WCN3990, Wear 4100+ Platform, WSA8810, WSA8815, WSA8830, WSA8835, X55 5G Modem-RF System, X75 5G Modem-RF System, XR1 Platform and XR2 5G Platform. It has been rated as critical. This issue affects some unknown processing of the component HLOS. The manipulation leads to memory corruption. The identification of this vulnerability is CVE-2023-33077. An attack has to be approached locally. There is no exploit available. It is recommended to upgrade the affected component.