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CVE-2023-33067 | Qualcomm 7c+ Gen 3 Compute Audio memory corruption
A vulnerability, which was classified as critical, was found in Qualcomm 7c+ Gen 3 Compute, 429 Mobile Platform, 778G+ 5G Mobile Platform SM7325-AE, 778G 5G Mobile Platform, 780G 5G Mobile Platform, 782G Mobile Platform SM7325-AF, 820 Automotive Platform, 835 Mobile PC Platform, 855 Mobile Platform, 855+, 860 Mobile Platform SM8150-AC, 865 5G Mobile Platform, 865+ 5G Mobile Platform SM8250-AB, 870 5G Mobile Platform SM8250-AC, 888 5G Mobile Platform, 888+ 5G Mobile Platform SM8350-AC, 1200 Wearable Platform, 9206 LTE Modem, AQT1000, AR8035, Auto 5G Modem-RF Gen 2, C-V2X 9150, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, MDM9628, MDM9650, MSM8996AU, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QAMSRV1H, QAMSRV1M, QCA6310, QCA6320, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6564A, QCA6564AU, QCA6574A, QCA6574AU, QCA6584AU, QCA6696, QCA6698AQ, QCA8081, QCA8337, QCA9367, QCA9377, QCC710, QCN6224, QCN6274, QCN9074, QCS410, QCS610, QFW7114, QFW7124, Qualcomm Video Collaboration VC1 Platform, Qualcomm Video Collaboration VC3 Platform, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SA8650P, SA8770P, SA8775P, SA9000P, SD835, SD855, SD865 5G, SD888, SDM429W, SM7315, SM7325P, Smart Audio 200 Platform, SRV1H, SRV1M, SXR2130, WCD9326, WCD9330, WCD9335, WCD9340, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3610, WCN3620 and WCN3660B. Affected is an unknown function of the component Audio. The manipulation leads to memory corruption. This vulnerability is traded as CVE-2023-33067. An attack has to be approached locally. There is no exploit available. It is recommended to upgrade the affected component.