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CVE-2023-33094 | Qualcomm 4 Gen 1 Mobile Platform VK Synchronization memory corruption
A vulnerability was found in Qualcomm 4 Gen 1 Mobile Platform, 7c+ Gen 3 Compute, 8 Gen 1 Mobile Platform, 8 Gen 2 Mobile Platform, 8+ Gen 2 Mobile Platform, 480 5G Mobile Platform, 480+ 5G Mobile Platform SM4350-AC, 660 Mobile Platform, 680 4G Mobile Platform, 685 4G Mobile Platform SM6225-AD, 690 5G Mobile Platform, 695 5G Mobile Platform, 750G 5G Mobile Platform, 765 5G Mobile Platform SM7250-AA, 765G 5G Mobile Platform SM7250-AB, 768G 5G Mobile Platform SM7250-AC, 778G+ 5G Mobile Platform SM7325-AE, 778G 5G Mobile Platform, 780G 5G Mobile Platform, 782G Mobile Platform SM7325-AF, 865 5G Mobile Platform, 865+ 5G Mobile Platform SM8250-AB, 870 5G Mobile Platform SM8250-AC, 888 5G Mobile Platform, 888+ 5G Mobile Platform SM8350-AC, AR8035, Auto 5G Modem-RF, CSRA6620, CSRA6640, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QCA6391, QCA6426, QCA6436, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCA8081, QCA8337, QCM4325, QCM6490, QCM8550, QCN6024, QCN9011, QCN9012, QCN9024, QCS410, QCS610, QCS6490, QCS7230, QCS8250, QCS8550, QRB5165M, QRB5165N, Qualcomm 215 Mobile Platform, Qualcomm Video Collaboration VC1 Platform, Qualcomm Video Collaboration VC3 Platform, Qualcomm Video Collaboration VC5 Platform, Robotics RB5 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SD660, SD865 5G, SD888, SG4150P, SG8275P, SM7250P, SM7315, SM7325P, SM8550P, Smart Audio 400 Platform, SW5100, SW5100P, SXR2130, W5+ Gen 1 Wearable Platform, WCD9326, WCD9335 and WCD9341. It has been classified as critical. Affected is an unknown function of the component VK Synchronization. The manipulation leads to memory corruption. This vulnerability is traded as CVE-2023-33094. An attack has to be approached locally. There is no exploit available. It is recommended to upgrade the affected component.